Abstract
We present a method to study separately the electrical transport properties of the grain boundaries (GBs) formed at the top and at the bottom edges of YBa2Cu3O7−δ(YBCO) step-edge Josephson junctions. The step-edge junctions were fabricated on (100) LaAlO3 steps using tilted Ar ion milling to define the electrodes and the microbridges. Due to the shadowing effect of the step, a continuous YBCO stripe remains along and at the bottom of the step on both sides of a microbridge. We found that the top GB is responsible for the weak link behavior of our step-edge junctions. The transport properties were correlated with the different microstructural properties of the two GBs formed at the edges of the step.
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