Abstract
Slip propagation through grain boundaries is a process which is, in part, responsible for grain size strengthening. TEM characterization of a slip propagation event combined with quantitative stress analysis allows determination of the critical stress and micromechanism for the event. Such an analysis is presented here.Commercially pure alpha brass(30 w/o Zn) was rolled to 125um and was then annealed in a dry hydrogen atmosphere at 800°C for one hour. The material was lightly deformed, and samples prepared using standard electopolishing techniques. This was then examined in a JEOL 200CX operating at 200keV.
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