Abstract
Thermal conductivity and thermal diffusivity are two important physical properties for designing any food engineering processes1. The knowledge of thermal properties of the elements, compounds and different materials in many industrial applications is a requirement for their final functionality. Transient plane source (tps) sensors are reported2 to be useful for the simultaneous measurement of thermal conductivity, thermal diffusivity and volumetric heat capacity of insulators, conductor liquids3 and high-TC superconductors4. The tps-sensor consists of a resistive element in the shape of double spiral made of 10 micrometer thick Ni-foils covered on both sides with 25 micrometer thick Kapton. This sensor acts both as a heat source and a resistance thermometer for recording the time dependent temperature increase. From the knowledge of the temperature co-efficient of the metal spiral, the temperature increase of the sensor can be determined precisely by placing the sensor in between two surfaces of the same material under test. This temperature increase is then related to the thermal conductivity, thermal diffusivity and volumetric heat capacity by simple relations2,5. The tps-sensor has been used to measure thermal conductivities from 0.001 Wm−1K−1to 600 Wm−1K−1 and temperature ranges covered from 77K– 1000K. This talk gives the design, advantages and limitations of the tpl-sensor along with its applications to the measurementof thermal properties in a variety of materials.
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More From: IOP Conference Series: Materials Science and Engineering
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