Abstract
High performance low temperature co-fired ceramic (LTCC) dielectrics is highly desired for next generation information technology. The rational design is a key issue for the development of new LTCC materials. In comparison to the design of conventional electroceramics, more attention should be paid on the formation process of the material structure for that of LTCC, in addition to the physical properties, due to the special requirement in fabrication processing. In this paper, sintering mechanism of three types of LTCC materials, i.e., glass-ceramics, glass ceramic composite, and glass bonded ceramics, as well as important factors of their dielectric properties are discussed and summarized, and the design strategies for LTCC dielectrics, based on new matrix materials with much lower sintering temperature or higher quality, are proposed. As an example for rational design, oxyfluoride glass-ceramic based dielectrics, a new class of LTCC materials with low ɛr, is analyzed.
Highlights
Rapid development of information technology industry requires high integration of circuits and high density of package
We introduced the design strategy of a new lowpermittivity low temperature co-fired ceramics (LTCC) material system Oxyfluoride Glass-ceramics
(1) Low sintering temperature: It is believed that the main difficulties in the development of LTCC materials are not related to their dielectric properties but to their sintering behavior and chemical compatibility
Summary
Rapid development of information technology industry requires high integration of circuits and high density of package. As a new technology for fabrication of monolithic ceramic devices and modules with three dimensional integration structures, low temperature co-fired ceramics (LTCC) supply a possibility to for passive integration and packaging-on-system (SOP), so it has resulted in an intensive research and become one. The term ‘low temperature co-fired ceramic’ means that the ceramic dielectric structure and conductive, resistive, and other dielectric materials are fired in same time at a relative low temperature (less than 900 °C). This indicates that the materials will fit much more rigorous processing requirements in addition to their physical properties.
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