Towards automated optimization, multidimensional parametrization, and synthesis with electromagnetic solvers in electronic packaging and RF circuit design

Abstract

High-speed applications in radio frequency, mixed-signal, and digital packaged electronics now necessitate the use of 3D, full-wave electromagnetic field solvers. The widely varied applications now involved in System-in-Package (SiP), System-on-Chip (SoC), Package-on-Package (PoP), three-dimensional integrated circuit (3DIC) technology including through-Silicon vias (TSVs) range from design and verification of the power delivery network (PDN), signal integrity and channel modeling of high-speed serial and parallel links, electromagnetic interference (EMI) and radiation, simultaneous switching noise (SSN), and voltage drop and ground bounce modeling amongst others. In addition, designers need to co-design chip I/O, packages, and board subsections nearly simultaneously in order to satisfy system-level signal integrity (SI), power integrity (PI), and EMI constraints. EM field solution is needed not merely in the complete verification of such systems but also in early design. Unfortunately, most EM simulators continue to be verification tools, merely masquerading as design tools. In this paper we discuss the challenges and needs associated with EM-aware design. In particular, we focus on digital microelectronics packages and RF frontend integrated circuits. We discuss how multidimensional parametrization, optimization, and synthesis need to be taken into account while creating simulator flows that will enable early design.