Top-down fabrication of large-area GaN micro- and nanopillars

Abstract

Large-area gallium nitride (GaN) micro- and nanopillar (NP) arrays were fabricated by plasma etching of lithographically patterned GaN thin-film grown on Si substrate. Deep-ultraviolet lithography, inductively coupled plasma (ICP) etching, and subsequent chemical treatments were effectively utilized to fabricate GaN pillars with diameters ranging from 250 nm to 10 μm. The impact of various plasma etching process parameters and chemical etchants on the morphology, strain, and surface defects of these NPs were studied using scanning-electron microscopy, photoluminescence (PL), and Raman spectroscopy. It was found that the shape of the NPs can be controlled by the substrate temperature during the plasma etch and by using different gas chemistries. Room-temperature PL and Raman spectroscopy measurements revealed significant strain relaxation in 250 nm diameter pillars as compared to 10 μm diameter pillars. PL measurement also indicated that the surface damage from the plasma etch can be removed by etching in KOH-ethylene glycol solution. Post-ICP selective wet chemical etch enabled us to fabricate functional structures such as micro- and nanodisks of GaN, which potentially could be utilized in nitride-based resonators and lasers.