To study the effect of Ni particles on microstructures and mechanical properties of Indium-Bismuth solder alloy

Abstract

In this work, Ni particles were added to the In-34Bi solder alloy to enhance the mechanical properties of solder at ambient temperature. The microstructure seems to be fingerprint-like structures similar to pearlitic structures as seen in eutectoid steel. However, in this case, InBi2bands are seen in the Indium matrix. The distribution of Nickel particles was seen in backscattered images of scanning electron macroscopic images. Mechanical properties are improved by the addition of Ni particles in In-34Bi-1Ni solder alloy. The solder alloy's hardness has improved by 36%, its 0.2% proof stress has risen by 34%, and its ultimate tensile strength has increased by 40%. Distribution of Ni particles in In-34Bi-1Ni solder alloy confirmed In2Bi and Ni2In3. The presence of Ni and Ni2In3 tends to decrease ductility from 50% to 35%. The addition of Ni particles in In-34Bi-1Ni showed significant improvements in mechanical properties.