Abstract
This novel method of depositing a titanium nitride layer onto metallic surfaces was originally developed to reduce the effects of multipactoring in the Fusion Materials Irradiation Test (FMIT) accelerator. The constraints of room-temperature deposition and the large surface area of the inside of the accelerator cavity (∼106 cm2) effectively prevented using the usual sputter-source deposition of titanium nitride. The method described in this paper was developed to overcome the limitations of the sputtering methods and provide a more durable surface layer than one obtained by vacuum deposition of titanium followed by venting to a nitrogen atmosphere. The nitride layer produced by our method is flexible and very durable. Thin copper samples retain the integrity of the nitride surface even after bending of the samples to moderately small radii. Sanding of the coated surfaces is the only way to remove the coating. The nitride layer produced by this method was effective in eliminating multipactoring in the FMIT accelerator. Since that time, we have continued to improve the deposition method and have obtained good results on a wide variety of materials ranging from copper to stainless steel to glass and ceramic surfaces.
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