Abstract

Reactive transition-metal (TM) nitride film growth employing bias-synchronized high power impulse magnetron sputtering (HiPIMS) requires a detailed knowledge of the time evolution of metal- and gas-ion fluxes incident at the substrate plane in order to precisely tune momentum transfer and, hence, provide the recoil density and energy necessary to eliminate film porosity at low deposition temperatures without introducing significant film stress. Here, the authors use energy- and time-dependent mass spectrometry to analyze the evolution of metal- and gas-ion fluxes at the substrate plane during reactive HiPIMS sputtering of groups IVb and VIb TM targets in Ar/N2 atmospheres. The time- and energy-integrated metal/gas ion ratio NMe+/Ng+ incident at the substrate is significantly lower for group IVb TMs (ranging from 0.2 for Ti to 0.9 for Hf), due to high N2 reactivity which results in severely reduced target sputtering rates and, hence, decreased rarefaction. In contrast, for less reactive group VIb metals, sputtering rates are similar to those in pure Ar as a result of significant gas heating and high NMe+/Ng+ ratios, ranging from 2.3 for Cr to 98.1 for W. In both sets of experiments, the peak target current density is maintained constant at 1 A/cm2. Within each TM group, NMe+/Ng+ scales with increasing metal-ion mass. For the group-VIb elements, sputtered-atom Sigmund-Thompson energy distributions are preserved long after the HiPIMS pulse, in contradistinction to group-IVb TMs for which the energy distributions collapse into narrow thermalized peaks. For all TMs, the N+ flux dominates that of N2+ ions, as the molecular ions are collisionally dissociated at the target, and N+ exhibits ion energy distribution functions resembling those of metal ions. The latter result implies that both N+ and Me+ species originate from the target. High-energy Ar+ tails, assigned to ionized reflected-Ar neutrals, are observed with heavier TM targets.

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