Abstract
Time-dependent dielectric breakdown (TDDB) is a major concern for low-k organosilicate dielectrics. To examine the effect of plasma exposure on TDDB degradation, time-to-breakdown measurements were made on porous SiCOH before and after exposure to plasma. A capillary-array window was used to separate charged particle and vacuum ultraviolet (VUV) photon bombardment. Samples exposed to VUV photons, and a combination of VUV photons and ion bombardment exhibited significant degradation in breakdown time. The samples exposed to VUV photons and ion bombardment showed more degradation in breakdown time in comparison to samples exposed to VUV photons alone.
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