Abstract

1–2 MeV He ion RBS and electron diffraction have been used to study the Ti silicide formation induced by As ion beam mixing. Upon As bombardment with dose range from 1 x 1015-1 x 1016 As/cm2, a uniform layer of amorphous TiSi phase is formed at the interface of Ti/Si, and the thickness of the TiSi layer is linearly proportional to the square root of implantation dose. After high dose As ion implantation, the amorphous TiSi exists even after post-annealing at 650°C for 30 min. The mechanism for these phenomena is discussed.

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