Through Hole Component Inspection Monitoring System

Abstract

For PCBA with through hole components, there is no easy, automated way of inspection like using AOI and AXI as employed for the Surface Mount Technology (SMT) components. As there is no such specific efficient inspection tool, till date manual inspection is the only solution for identifying defects in the Through Hole technology. Thus proposed work is defined to inspect few of the through hole component defects in an automated approach. Even though AXI is capable of detecting the Through Hole defects, it is rarely implemented due to its inaccurate results and cost. This results in increased cycle time, moderate efficiency, expensive and is very difficult to be focused for the operator on such repetitive task and that in turn affects the productivity and yield. As not much of research work has been carried out to find solution, a simple image processing technique has been tried here. In the proposed system a pattern matching technique is used for inspecting the defects like presence and absence of the Through Hole components in assembled PCB. In this work few different PCB images of same product have taken for inspection, further the inspection result is generated using LabVIEW Software.