Three-dimensional super-chip integration technology using self-assembly technique

Abstract

We proposed a new three-dimensional (3-D) super-chip integration technology using self-assembly technique. Many chips are simultaneously aligned and bonded onto lower chips using .a self-assembly technique in a super-chip integration. It was confirmed that Si chips with sizes of 1 mm square to 5 mm square were precisely assembled on Si wafers with high alignment accuracy of less than O.5µm. We have fabricated 3-D LSI test chips by a super-chip integration technology.