Abstract
A proposal is made in this paper to realize 3-ways chip to chip communication via 3D photonic structure. The mechanism of the work is understood with the help of absorbance and reflectance of the structure. The absorbance is determined using the analytical treatment where reflectance is computed using the photonic bandgap analysis, which is found with the help of plane wave expansion method. Further the present research deals with low power input signal whose potential varies from 0.55 to 1 V because to avoid the heat generation in nanoelectronics and nanophotonic circuits where circuit comprises chip, LED and photo detector along with waveguide (3D photonic structure). The output results indicate that a proper combination of lattice spacing of silicon-based 3D photonic structure and diameter of air holes could be a right candidate to realise 3-ways communication.
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