Abstract
The known thinning and flood-fill algorithms are implemented in the approach. The template PCB image and the manufactured PCB image are used to determine coordinates of specific points: endings and switches. The flood-fill algorithm is used to mark traces and to detect defects of connectivity. The flood-fill algorithm also is used to detect background defects. Defects of traces are found and measured by mean intensity and gradient functions, which are applied to suspicious routes.
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