Abstract
The known thinning and flood-fill algorithms are implemented. Specific points in the skeleton of the etalon PCB image are being detected and with help of the flood-fill algorithm they are being assigned to the nested set model of the PCB image: board - chains - contacts - pixels. On the second step of the algorithm this model is being used to detect defects in the manufactured PCB. The second step contains the thinning and flood-fill algorithms too. Some examples are given to illustrate the approach.
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