Abstract
Demands for increasing power density and levels of functional integration in switch-mode power converters require power electronics manufacturers to develop innovative packaging solutions for power semiconductor devices and modules. Three-dimensional (3-D) packaging techniques offer the potential of lower resistance, higher current handling capability, smaller volume, better thermal management capability, and high reliability. In this paper, we present the constructions and some electrical and thermomechanical analyses of four 3-D packaging approaches that have been developed within the Center for Power Electronics Systems-an NSF Engineering Research Center.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
