THREE‐DIMENSIONAL CONSTRAINT EFFECTS ON STRESS INTENSITY DISTRIBUTIONS IN PLATE GEOMETRIES WITH THROUGH‐THICKNESS CRACKS

Abstract

AbstractThree‐dimensional finite element analyses of through‐thickness cracks in plate geometries are presented. It is shown that the local constraint variation towards the crack tip causes an increase in stress intensity which is neglected in analyses which assume a constant stress state throughout the geometry. This means that stress intensity factors for these types of crack geometries are a factor (1 — v2)‐0.5 higher than generally reported in stress intensity handbooks.Analyses on crack tunnelling situations show that if plane stress dominates the global behaviour, an almost constant stress intensity across the thickness is reached for a relative tunnelling depth of a 2.5% of the plate thickness. For geometries which are not predominantly in plane stress this value will be somewhat larger. Crack front tunnelling does not influence the mean stress intensity across the thickness.Shear lips are shown to reduce the mean equivalent stress intensity (the mode I stress intensity which has the same energy release rate as the actual combined mode I, II and III loading) by a factor equal to the square root of the ratio between plate thickness and projected length of the crack front. This may explain the reduction in crack growth rate caused by shear lips during fatigue crack growth experiments. The reduction of the mode I stress intensity factor is considerably larger, which may cause a further reduction of fatigue crack growth rate for crack growth mechanisms that depend primarily on the mode I crack tip loading.Analyses on CNT and SENB specimens show that the conclusions reached on infinite plate models also hold for real structures. However for an SENB specimen with an uncracked ligament equal to the plate thickness, the overall constraint is larger than that of a pure plane stress situation, and the effect of stress intensity increases due to the constraint transition is less pronounced.