Abstract
The first step in the surface mount technology is the printing of the solder paste. The amount of solder placed on the cooper pad is important in guaranteeing an acceptable quality of soldering. Experimental works and studies for this process consume time and cost. There is a need for a cost-effective method to study this process. The simulation method has shown as a good alternative method for the solder paste printing process. Thus, this study presents a 3D computer simulation of stencil printing for the deposited volume prediction of solder paste. The volume of fluid (VOF) method integrated with the cross viscosity model was used for the numerical simulation. A widely used industry lead-free solder paste Sn/Ag/Cu (SAC305) of type 3 was utilized. The experimental and simulation results for filling volume of solder paste at different aperture sizes were compared. Results for different aperture sizes show a similar trend and agree well with the experimental results. This study was extended to investigate stencil printing at different squeegee speeds and aperture sizes. The squeegee speed of 35 mm/s provided the highest solder paste volume in the aperture with acceptable printing time.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: The International Journal of Advanced Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
