Abstract
Cyanate ester (CE) resins with higher heat resistance, lower coefficients of thermal expansion (CTEs), and lower water absorption ratios are highly desired in printed circuit boards (PCBs). In this work, a CE was modified by copolymerization with a long-chain thioether bismaleimide (SBMI) to form a thioetherimide-modified CE (SBT). The results indicated that SBT had a wider processing window and better processing properties than a common bismaleimide-modified CE resin (MBMI). After molding with a glass fiber cloth, the composites (GSBT) exhibited moisture adsorption in the range of 1.4%–2.0%, high tensile strength in the range of 311–439 MPa, good mechanical retention of 70%–85% even at 200 °C, and good dimension stability, with coefficients of thermal expansion in the range of 17.3–18.6 (×10−6 m/°C). Such GSBT composites with superior properties would be good candidates for PCB applications.
Highlights
The modern printed circuit board (PCB) industry requires more substrate layers, a higher wiring density, a larger working frequency range, and a smaller insulation thickness
Novel polymers or polymer composites with higher heat resistance, lower coefficients of thermal expansion (CTE), lower water absorption ratios, and superior dielectric properties are highly required in the PCB industry
Cyanate esters (CEs) are popular thermoset polymeric materials with good processability, excellent moisture and heat resistance, high dimensional stability, good dielectric properties, and much lower cost compared to polyimide resins, which have been widely used in the production of high-frequency
Summary
The modern printed circuit board (PCB) industry requires more substrate layers, a higher wiring density, a larger working frequency range, and a smaller insulation thickness. The cross-link density of the resin can be reduced by increasing the molecular weight of the has a glass transition temperature of up to 250 C or higher. Though the BMI has a high heat resistance, BMI pre-polymer, resulting in a resin system wider processing window and The higher tensile its high cross-link density is responsible for thewith highabrittleness of the cured product. Significantly improves the processability and toughness of the BTpre-polymer, resin and provides density ofThis the resin can be reduced by increasing the molecular weight of the resultinga shortcut decreasing brittleness of BT and CE of the in a resinfor system with a the wider processing window andresins higher[21,22]. Withexcessive an imidemelt structure avoids the issue of reduced heat resistance but brings about a difficulty in in this work, a new type of long-chain thioether (SBMI). Further comprehensive characterizations were performed on the SBMI and its composites
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