Abstract
The cyanate ester (CE) resin is widely used for electrical and electronics packaging due to its excellent dielectric properties, high heat resistance and low water absorption. However, the low thermal conductivity limits its application in highly integrated circuits. In this work, cyanate ester (CE) based composites filled with silicon dioxide (SiO2) coated sulfonated graphene oxide (SGO) were successfully prepared by sol‐gel process to coordinate its thermal conductivity and dielectric properties. The obtained composites showed enhanced thermal conductivity and maintained good insulating properties. It was found that the thermal conductivity of the composites increased with the loading of SiO2@SGO hybrids and reached a maximum of 0.71 W·m−1·K−1 with 25 wt% fillers, 3.4 times higher than the baseline CE resin. This increase is attributed to the presence of SiO2@SGO, which improved the phonon transmission channel in CE resin, and the surface modification on SGO also reduced interfacial thermal resistance between SiO2@SGO and CE resin. The thermal stability of the composites has been improved from about 300°C to 390°C. Furthermore, the prepared SiO2@SGO/CE composites exhibited excellent dielectric performance for electronics packaging applications. POLYM. COMPOS., 39:E1565–E1573, 2018. © 2017 Society of Plastics Engineers
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
