Abstract
We present a metamaterial substrate designed to act as a high impedance thin slab that can be used to integrated low-profile (subwavelength thickness) antennas in components or packages. A transverse equivalent network (TEN) model accurately describing the reflection properties of the impedance substrate is also provided to facilitate its design. Then, we develop a low profile planar antenna consisting of a printed dipole located on top of the parallel metamaterial substrate. The high impedance of the substrate permits to locate the metallic dipole very close to the substrate itself without inhibition of the dipole radiation. The substrate prevents radiation from traveling across the substrate, resulting in a low profile antenna with high efficiency, even though the antenna system is integrated on top of a lossy structure. Two possible feed structures for the dipole over the impedance surface are considered, and simulation data are presented to illustrate their respective performance.
Highlights
We have seen a growing interest in installing small antennas in packaging and devices
First we present a novel metamaterial substrate designed to act as a high impedance thin slab
In this work we have focused on two important technological novelties aiming at designing antennas that can be integrated into complex systems
Summary
We have seen a growing interest in installing small antennas in packaging and devices. The substrate inhibits radiation to travel across, resulting in a low profile antenna with high efficiency, even though the antenna system (comprising the dipole and thin metamaterial substrate) is integrated on top of a lossy structure. The proposed low profile antenna design is suitable for integration in supporting platforms like metallic structures or chips where active components could be assembled, and can be fabricated in CMOS technology. It is suitable for wearable antennas that have the constraints of being flat and simple to be realized n thin flexible substrates. Fabrication and testing of a prototype will be presented during the oral presentation
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