Abstract
A comparison is given of the use of p/sup +/-polysilicon and n/sup +/-polysilicon as the gate material for high-performance CMOS processes in fully depleted, thin SOI (silicon on insulator) films. Experimental devices on Simox substrates are compared with numerical simulations. It is found that n-channel transistors with p-poly gates require lower channel doping levels than their n-poly counterparts, leading to higher gains and easier control of the threshold voltage. The lower electric fields in the p-poly transistor also result in improved drain breakdown characteristics. Control of the subthreshold and punch-through characteristics of the p-poly device requires the use of very thin films when there is significant fixed positive charge at the interface with the buried oxide. >
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