Abstract
Power dissipation in semiconductor devices peak over short durations with scales much shorter than the thermal time constant. The typical heat sink is too far away from the junction hotspot to provide effective temporal cooling over such durations. Here, we theoretically explore on-chip Peltier cooling over short (~100 ms) durations, as a potential solution for managing transients near the junction. Choosing a simple unipolar Peltier device, we evaluate the thermoelectric property requirements for achieving net cooling using a steady Peltier current. Net cooling occurs when the peak transient temperature rise is reduced in the presence of an operating thermoelectric device in comparison with that in its absence. When the substrate is bulk silicon, a large power factor (>50 mW/mK2) and thermal conductivity (>100 W/mK) are required for net cooling. The requirement is less stringent and the impact more promising in wide-bandgap electronics with low conductivity substrates, where Peltier cooling reduces the impact of interface thermal resistance. This study points out materials research priorities for on-chip Peltier cooling and paves the way for effective realization of transient thermal management in proximity to the junction.
Highlights
M INIATURIZATION and 3-D integration trends in electronics have led to increased spatial nonuniformity in on-chip heating and higher localized heat fluxes, which is a key focus for current thermal management [1]–[3]
In mobile applications, power dissipation increases to peak levels in short durations that are much shorter than the thermal time constant
We investigated the possibility of on-chip Peltier cooling for transient thermal management in close proximity to hotspots
Summary
M INIATURIZATION and 3-D integration trends in electronics have led to increased spatial nonuniformity in on-chip heating and higher localized heat fluxes, which is a key focus for current thermal management [1]–[3]. We explore whether an on-chip thermoelectric cooler (TEC) may be more useful in temporal thermal management of hotspots over short (∼100 ms) time durations. Past theoretical work on transients in the TEC operation considered the effect of transient Peltier currents in the presence of a steady hot-side temperature [7]–[10]. They mainly studied the impact of transients on the drive (Peltier) current. In a further departure from past work, we consider operating the TEC as a cooler (and not a refrigerator), where the Peltier heat flows from the hot to the cold side augmenting Fourier heat conduction, rather than opposing it.
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