Abstract

For the proper performance of a thermoelectric device, are needed materials with high intrinsic merit gures, this amount is a function of the thermoelectric properties of the material. However although the bulk could present good values in their thermoelectric properties, when trying to build a thermoelectric device, other aspects must be considered. A aspect that For example for cooling, an important quantity is the maximum temperature difference that can be achieved by a thermocouple. This paper shows how this amount is related to dimensional parameters of the thermocouple. Particularly is dened the transverse area ratio of the thermocouple legs, whose value more efficient is function of the thermoelectric properties ρ and k.

Highlights

  • Thermoelectric eects are exploited for the operation of solid state devices known as thermoelectric modules (TEM), which are used in diverse applications [1]

  • A thermoelectric device have the following advantages: no moving parts, ideal when precise temperature control is required, ability to lower temperature below ambient, heat transport controlled by current input, compact size make them useful for applications where size or weight is a constraint, ability to alternate between heating and cooling

  • In this work we have studied a basic aspect for the design of a conventional thermocouple for thermoelectric cooling, with reference to the model of a unileg

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Summary

Introduction

Thermoelectric eects are exploited for the operation of solid state devices known as thermoelectric modules (TEM), which are used in diverse applications [1]. The TEM's are made of thermoelectrics material, whose quality of performance is given by a parameter known as the gure of merit. It is dened by the following equation, [6]:. A technique for improving the design of TEM's is to work with the equations of the theory of thermoelectricity and heat balances applied to heat exchangers, taking into account geometric or dimensional parameters of the thermoelectric module. For the improvement of thermoelectric devices, the following aspects should be addressed

Current input to the device needs to be optimized
Conclusion
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