Abstract
Adsorption cooling systems can be made compact enough to fit into electronic enclosures by the use of Thermo-Electric (TE) devices for heat regeneration and recovery. While such systems have been studied for near room temperature cooling of electronics, their straightforward application to harsh (high temperature) environments can prove detrimental to the TE devices. Cyclic temperature variations coupled with heat pump requirements can greatly reduce the performance of a TE device. Moreover the temperature overlap between adsorption and desorption processes, that is usually desired for greater heat recovery, increases the temperature variations that a TE device has to go through. Hence in the context of using TE device to regenerate and recover heat in between the adsorbent beds, it becomes important to balance the advantages and drawbacks of thermal overlap. In the present work the suitability of temperature overlap for thermoelectric assisted heat regeneration and recovery has been theoretically examined. It was found that greater temperature overlap in between adsorption and desorption processes is not beneficial for TE device assisted heat regeneration and recovery.
Published Version
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