Abstract

We studied the energetics and kinetics of microstructural evolution in copper films by estimating the magnitude of various possible driving forces for microstructural change that can be present in the as-deposited film. A driving force of at least 100 J/cm3 is required to account for the speed at which the grain boundaries move at room temperature. This value cannot be accounted for by only considering the minimization of grain-boundary energy and possible effects related to surface and strain energy as the main driving mechanisms. It is suggested that the additional driving force which is needed to explain the speed at which the grains recrystallize, is originating from a high density of defects within the as-deposited grains.

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