Abstract
A thermochemical/molecular model is developed for breakdown in high dielectric constant materials and the model suggests that a fundamental relationship exists between dielectric breakdown strength (Ebd) and dielectric constant (k). The model indicates that Ebd should show an approximate (k)−1/2 dependence over a wide range of high dielectric constant materials. The model also predicts that the field-acceleration parameter (γ), from time-dependent dielectric breakdown (TDDB) testing, should increase with dielectric constant. TDDB and Ebd data are presented for model support. The thermochemical model suggests that the very high local electric field (Lorentz-relation/Mossotti-field) in high-k dielectrics tends to distort/weaken the polar molecular bonds making them more susceptible to bond breakage by standard Boltzmann processes and/or by hole capture and thus lowers the breakdown strength.
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