Thermo-viscoelastic Analysis of Thermal Residual Stress and Warp Deformation Influenced by Material Properties in Plastic Laminated Beams

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Thermal residual stresses and warp deformation of laminated beams constructed from a LSI chip and adhesive, which is the basic structure for plastic composites, were theoretically calculated by using thermo-viscoelastic fundamental equations based on linear-viscoelasticity theory.The results obtained are as follows;(1) Tensile residual stresses at the surface of the chip and compressive residual stresses around the contact area are generated in a LSI chip, while tensile residual stresses are generated in the adhesive material.(2) In order to reduce the interfacial thermal residual stress and warp deformation, the following properties of adhesive materials are desirable;(i) high glass transition temperature(ii) low thermal expansion coefficient(iii) low relaxation modulus