Abstract
A stress analysis model for determining the thermal stresses in the vicinity of a plated-through-hole in a printed wiring board is presented. The model is based on axi symmetnc deformation and the superposition of an exact elasticity solution for far field stresses (away from the outer free surfaces) and an approximate near field solution (near the outer free surfaces). The approximate solution exactly satisfies point-by-point equilib rium, but violates compatibility.
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