Thermally induced deformation of solder joints in real packages: Measurement and analysis

Abstract

The paper presents a hybrid experimental and analytical approach to track the deformation of solder joints in an electronic package subject to a thermal process. The solder joint strain is directly measured using a computer vision technique. The strain measurement is analyzed following an approach that is devised based on an established solder constitutive relation. The analysis leads to the determination of the solder joint stress and in turn, to the separation of the elastic, plastic and creep strain from the measured total strain. The creep strain rate and stress–strain hysteresis loop are also obtained. Two case studies are presented to illustrate the applications and to show the viability of the approach. Each case involves a resistor package with SAC (Sn95.5Ag3.8Cu0.7) solder joints, which is subjected to a temperature variation between ambient and 120 °C. The results confirm that shear is a dominant strain component in such solder joints. The shear strain varies nearly in phase with the temperature whereas the shear stress exhibits a different trend of variation due to stress relaxation. The peak shear stress of around 10 MPa to 15 MPa are found, which occur at near 70 °C in both cases, when the temperature ramps up at approximately 3 °C/min. The creep shear strain goes up to 0.02 and accounts for over 80% of the total shear strain. The creep strain rate is in the order of magnitude of 10 −5 s −1. Responding to the temperature cycling with such moderate rate, the creep strain shows modest ratcheting while the stress–strain hysteresis stabilizes in two cycles.