Thermal Stressed State of a Bimaterial with Interface Crack Filled with a Compressible Liquid

Abstract

We formulate the problem of thermoelasticity for a bimaterial with interface crack filled with a liquid with regard for the pressure and heat conductivity of the liquid. We consider the case of partial crack closure on the edges under the action of a compressive load and a heat flux. The problem is reduced to a system of nonlinear singular integrodifferential equations for a temperature jump between the crack faces and its opening displacement. The length of the contact zone is determined from the condition of smooth closure of crack faces at the points separating the open and closed parts of the crack. We analyze the changes in the crack length and height and in the pressure of liquid depending on the compressive loads, density of the heat flux, and its direction. We also determine the dependence of the mode-II stress intensity factor on the level of pressure and the thermal conductivity coefficient of liquid.