Thermal stress in flexible interdigital transducers with anisotropic electroactive cellulose substrates

Abstract

Thermal stress in flexible interdigital transducers a reliability concern in the development of flexible devices, which may lead to interface delamination, stress voiding and plastic deformation. In this paper, a mathematical model is presented to investigate the effect of material selections on the thermal stress in interdigital transducers. We modified the linear relationships in the composite materials theory with the effect of high curvature, anisotropic substrate and small substrate thickness. We evaluated the thermal stresses of interdigital transducers, fabricated with various electrodes, insulators and substrate materials for the comparison. The results show that, among various insulators, organic polymer developed the highest stress level while oxide showed the lowest stress level. Aluminium shows a higher stress level and curvature as an electrode than gold. As substrate materials, polyimide and electroactive cellulose show similar stress levels except the opposite sign convention to each other. Polyimide shows positive curvatures while electroactive cellulose shows negative curvatures, which is attributed to the stress and thermal expansion state of the metal/insulator composite. The results show that the insulator is found to be responsible for the confinement across the metal lines while the substrate is responsible for the confinement along the metal lines.