Thermal stress concentration factors for defects in plated-through-vias

Abstract

Plated-through-vias (PTVs) are subject to thermal stress during soldering and in service. Plating and manufacturing defects in the PTV walls (barrels) can create stress concentrations that frequently become the sites of crack initiation during thermal fatigue. This is of growing concern as processing temperatures increase due to the use of lead-free solders, and boards become thicker generating increased stress as PTV aspect ratios rise, making it more difficult to achieve uniform plating thickness throughout the barrel. Finite element analysis (FEA) has been used to develop correlations that can be used to calculate the stress concentration factors (SCFs) for five typical defects as a function of various geometric parameters. In terms of their severity, the defects were ranked as: (1) rapid thickness reduction (SCF ⩽ 13), (2) occasional waviness (SCF ⩽ 4.6), (3) gradual thickness reduction (SCF ⩽ 4), (4) wicking (SCF ⩽ 4) and (5) waviness (SCF ⩽ 3.1). The SCF due to an internal pad and the influence of an external pad-barrel corner crack were also investigated. The maximum stress at the defect is found by multiplying the SCF by the von Mises stress at the mid-plane of the corresponding idealized PTV. The latter can be found using either an analytical model or correlations as a function of the aspect ratio and board-to-barrel thickness ratio that were developed using FEA.