Abstract
The heat resistance of shock-compacted polycrystalline diamond (PCD) was investigated and compared with that of commercially available PCD. Shock treatment of PCD with and without silicon was performed by impacting an iron flyer plate 3.2 mm thick, at a velocity of 2.3 km/s. Neither significant graphitization nor cracking was observed after heat treatment of the obtained PCD with silicon at temperatures of 1000 and 1200°C for 30 min in vacuum. Vickers hardness of the compacted PCD decreased slightly with increasing temperature up to 1200°C, while the hardness remained unchanged after this treatment at 1000°C for the PCD with silicon. On the shock-compacted pure PCD, no crack formation was observed after heat treatment at temperatures of 1000 and 1200°C, but increasing heat treatment temperature caused an increase in the amount of graphite, and thus the hardness decreased. Therefore, the addition of silicon contributes to the improvement of the thermal stability of shock-compacted PCD.
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