Abstract

The effects of Pd, Ni, Nb, and Ti interface layers on the thermal stability of Ag films were investigated, and those metals that are appropriate for the interface layers were summarized. The results indicated that Ti and Nb interface layers resulted in thermally stable Ag films by improving the adhesion strength of the Ag films to SiO2 substrates and by enhancing the crystal orientation of Ag(111). It was determined that appropriate interface layer metals for Ag film should have a large Gibbs free energy of formation for the oxide and an appropriate atomic diameter ratio of dmetal/dAg.

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