Abstract
To ensure the audio system has stronger thermal environment adaptability under the harsh environment of heat load and thermal load generate by itself, carry out the thermal simulation analysis research. The thermal simulation analysis model is established by the finite element analysis method. In order to get the audio system temperature distribution and the temperature of components whose temperature rise obviously, complete the thermal simulation calculation. The simulation results show that, the highest temperature is 97 °C of the TFT circuit board, the highest temperature is 92 C of the main circuit board and the highest temperature is 72 C of the AIR circuit board, as the weak positions of the audio system under thermal environment, need to further optimize thermal design, and puts forward suggestions for improvement.
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