Abstract
Dy–α-SiAlON (Dy 1/3Si 10Al 2ON 15) using 5 wt.% BaAl 2Si 2O 8 (BAS) glass ceramic as an additive was synthesized by hot-pressing. The thermal shock resistance of the material was investigated. The results indicated that this material has very good thermal shock resistance. The critical temperature difference could reach 1100 °C. The gradual growth of the pre-existent cracks and the significant interfacial debonding between the SiAlON grains and the intergranular BAS phase were the reasons for the flexure strength losses at the thermal shock temperature difference below and above 1100 °C, respectively. The slight oxidation introduced by the heating process marginally benefited the residual strength by surface damage healing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
