Copper-based tungsten coating by CVD: Microstructure, thermal shock resistance and interfacial bond force

Abstract

Tungsten coating was fabricated on a pure copper substrate by chemical vapor deposition technique (CVD). The deposition rate was about 0.6 mm/h, and the average thickness of the W coating is197.3 μm. The thermal shock resistance of tungsten coating was investigated by thermal shock test, and the interface bonding force was characterized by scratch method. Experimental results show that the coating sample has good thermal shock resistance at 500 °C, and the W coating could sustain thermal shock 50 cycles at 1000 °C without visible failure. According to the scratch test results, it can be found that the effect of thermal shock frequency on the bonding force was obvious. After 10 thermal shocks, the interface bonding strength does not decrease significantly, but it decreases sharply after 30 thermal shocks at different temperatures.