Abstract

We present an original, accurate, closed-form expression for the thermal resistance of multifingers AlGaN/GaN on SiC FET devices. The model takes into account the thickness of GaN and SiC layers, the gate pitch, length, and width. The model's validity is verified by comparing it with the results of numerical simulations for many different devices. Very close (1-2%) agreement is observed in general. The model is also compared with experimental observations.

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