Thermal resistance calculation of AlGaN-GaN devices

Abstract

We present an original accurate closed-form expression for the thermal resistance of a multifinger AlGaN-GaN high electron-mobility transistor (HEMT) device on a variety of host substrates including SiC, Si, and sapphire, as well as the case of a single-crystal GaN wafer. The model takes into account the thickness of GaN and host substrate layers, the gate pitch, length, width, and thermal conductivity of GaN, and host substrate. The model's validity is verified by comparing it with experimental observations. In addition, the model compares favorably with the results of numerical simulations for many different devices; very close (1%-2%) agreement is observed. Having an analytical expression for the channel temperature is of great importance for designers of power devices and monolithic microwave integrated circuits. In addition, it facilitates a number of investigations that are not practical or possible using time-consuming numerical simulations. The closed-form expression facilitates the concurrent optimization of electrical and thermal properties using standard computer-aided design tools.