Abstract
A novel simulation tool, named Thermal Resistance Advanced Calculator, is presented Such a tool allows the straightforward definition of a parametric detailed thermal model of family of electronic packages with Manhattan geometry, in which anew thermal properties and/or geometrical details can vary in a chosen set. It then applies a novel parametric MOR-based approach for the automatic and fast extraction of a parametric compact thermal model of this family of electronic packages. Lastly, it automatically determines the JEDEC thermal metrics from this parametric compact thermal model for any choice of parameters in a negligible amount of time. The method is validated through the analysis of a family of exposed pad Quad Flat Packages.
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