Abstract
The paper describes experimental studies on the heat transfer performance of a wickless vapor chamber with a heat sink. A vapor chamber of 78 mm length and 64 mm width was fabricated with a thickness of 5 mm and tested for two different working fluids, copper-water and aluminium-water nanofluids with the filling ratio of 30% of the vapor chamber volume. As a baseline comparison de-ionized (DI) water is considered as a working fluid. The vapor chamber was tested for heat inputs ranging from 90 -150 W. The effects of heat input and metal concentration in the working fluids and the effect of particle deposition on the performance of the vapor chamber are presented. The thermal resistance of vapor chamber was decresed with the increase of the heat input for copper-water nanofluids while it remained constant for DIwater. Also the thermal resistance was found to be lower for higher concentration of the nanofluid.
Highlights
Future electronic systems especially computers and communication equipment are expected to be of small size, lightweight but with compact components that release very high magnitudes of heat
Vapor chambers have been mostly used in the base of the heat sinks and they work as heat spreaders to spread the heat from the hotspots and eventually dissipate it to environment
A vapor chamber is a vacuum vessel with a wick structure lining inside the walls which in turn is saturated with a working fluid
Summary
Future electronic systems especially computers and communication equipment are expected to be of small size, lightweight but with compact components that release very high magnitudes of heat. Vapor chambers have been mostly used in the base of the heat sinks and they work as heat spreaders to spread the heat from the hotspots and eventually dissipate it to environment. Go(2005) investigated the thermal performance of an acetone-charged vapor chamber heat sink containing micro wick structures for cooling microprocessors in PC desktop applications. In this experiment, the wick was modified to obtain a high aspect ratio of the micro channel. Carbajal et al (2006) analysed the temperature distribution of flat heat pipes with aluminium sandwich wick and compared the performance of the vapor chamber with a copper block. It was found that the temperature at the bottom surface of the vapor chamber is much flatter than that of the solid copper block. Kang et al (2012) carried out CFD simulation to study the temperature uniformity of vapor chamber heat spreader
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
