Abstract
AbstractThis study aims to evaluate the thermal performance and friction factor characteristics of the U‐shaped serpentine microchannel heat sink using three different nanofluids. Two distinct nanoparticles, namely Al2O3 (alumina) and CuO (copper oxide), were used for the preparation of nanofluids using water and ethylene glycol (EG) as base fluids. Three nanofluids, namely nanofluid I (Al2O3 + water), nanofluid II (CuO + water), and nanofluid III (CuO + EG), have been prepared. The results showed that the thermal conductivity of nanofluids was increased for all concentrations (from 0.01 to 0.3%), compared with base fluids. The theoretical values derived from the relationship between the Darcy friction factor showed a clear understanding of the fully developed laminar flow. Thermal resistance for nanofluid III was lower than other nanofluids, resulting in a higher cooling efficiency. The nanofluid mechanism and the geometry of the U‐shaped serpentine heat sink have led to the improvement in the thermal performance of electronic cooling systems.
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