Abstract

The present work investigates the thermal performance of a copper-based coupled impingement-effusion heat sink. A three-dimensional numerical analysis was executed for steady state, incompressible laminar, flow and conjugate heat transfer. A constant heat flux of 100W/cm2 was applied at the base of copper substrate while on the other side a heat sink model was designed. The jet plate consists of multiple impingement jet nozzles and each jet nozzle was surrounded by six effusion holes, computational domain was defined by applying symmetric boundary conditions. The effects of the design parameters such as jet diameter, effusion-hole diameter, stand-off and jet-to-effusionpitch were investigated. The analysis was carried out at a low Reynolds number of 200 to prevail laminar flow conditions. The maximum temperature rise, total pressure drop, area-averaged heat transfer coefficient, thermal resistance and pumping power were discussed with various design variables e.g., the ratio of the pitch-to-jet diameter, standoff-to-jet diameter and area ratio of jet-to-effusion hole. The design with higher standoff-to-jet diameter ratio offers lower overall thermal resistance while design with lower standoff-to-jet diameter ratios offer lower pressure drop penalty. Higher heat transfer was associated with lower pitch-to-jet diameter and higher standoff-to-jet diameter ratio. The functional relationship between the overall thermal resistance and the pumping power was studied, which presents the optimal front within the design space explored in the present study.

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