Thermal Optimization Design of a Intelligent Programmable Controller Based on CFD Software

Abstract

With the increasing functionality of intelligent programmable controllers and the continuous improvement in power and component density, the problem of rapidly rising temperatures during operation has become increasingly prominent, directly affecting the controller's lifespan and stability[1]. Therefore, improving the heat dissipation efficiency of intelligent programmable controller modules has become a key focus of research. This paper introduces a method of installing aluminum alloy heat sinks on the core chip of the controller and carefully designing the fin shape and size of the heat sink to enhance heat conduction and heat convection effects, improving heat dissipation performance. This paper also constructs a thermal equivalent model of the controller and simulates the impact of different fin parameters on heat dissipation performance. Experimental results show that when the fin height is 5 millimeters, thickness is 2 millimeters, and spacing is 4 millimeters, the heat sink exhibits the highest thermal conductivity and the lowest thermal resistance, achieving optimal heat dissipation effectiveness.