Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices.

Yuxin You,Sulian Tao,Beibei Zhang,Biao Tang,Rui Zhou,Zihui Liang,Dong Yuan

doi:10.3390/mi12030265

Abstract

Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction.

Highlights

With the increasing of the integration density of electronic devices, the high heat flux generated inside the devices has become a critical threaten to the reliability of performance [1]
We studied the effect of different treated surfaces on the heat dissipation performance of aluminum alloy heat sinks
The results show that the thermal emissivity can increase to 2.5 times with surface roughness increase

Summary

Introduction

With the increasing of the integration density of electronic devices, the high heat flux generated inside the devices has become a critical threaten to the reliability of performance [1]. Finned heat sinks, dissipating heat by natural convection or forced convection with fans [3], are widely used in cooling electronic devices. In these cooling systems, air is used as a coolant because it is easy to obtain and due to the simplicity, high reliability and low cost of the required equipment [4]. As the demand for cooling intensity increases, many heat sinks with diverse fin structures were reported, including flat-plate fin [5,6], pin fin [7,8], interrupted fin [9], slotted fins [10], etc. Many attempts in optimizing the structure on heat sinks, for instance, the width, height, distribution and shape of fins [3,5,8,11,12]

Methods

Results

Conclusion