Abstract
A thermal modeling procedure has been developed to calculate the temperature distribution of components in complex three-dimensional (3-D) switches and relays. The methods developed for dissecting the components, treating of thermal interaction among the components, and calculating of interface thermal resistance are reported. In particular, the knowledge of electrical "a-spot" is used to estimate solid-solid contact area and void area. The void areas do not contribute to electrical conductivity but do contribute to thermal conductivity. The method is used to more accurately estimate the interface thermal resistance which is very important in any thermal analysis program. Actual switches and relays were modeled using finite difference thermal analysis, and the results matched well with measured temperatures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
