Thermal, mechanical, and AC electrical studies of PVA–PEG–Ag2S polymer hybrid material

Abstract

Polymer hybrid films were prepared by solution casting technique, using polyvinyl alcohol–polyethylene glycol (PVA–PEG) blend host matrix as the organic component and Ag2S (in-situ formed) as the inorganic component. Differential scanning calorimetry (DSC) studies revealed the increased flexibility of polymer hybrid films, when compared to pure PVA–PEG blend film. Thermal stability of the hybrid film PPS3 (with AgNO3:Na2S ratio equal to 3.0 ml: 1.5 ml) which has uniformly distributed Ag2S nanostructures is more, when compared to other hybrid films, as revealed by thermogravimetric analysis (TGA). Polymer hybrid film PPS1 (with AgNO3:Na2S ratio equal to 1.0 ml: 0.5 ml) which has uniformly distributed Ag2S microstructures shows increased values of tensile strength and percentage elongation at break. The presence of Ag2S nanoparticles in PPS3 film has increased the overall toughness of the corresponding hybrid film. The highest bulk conductivity equal to 1.43 × 10–5 Sm−1 is observed for PPS4 film (with 4.0 ml: 2 ml ratio of precursors), which has a comparatively lower degree of crystallinity and porous structure. Impedance spectroscopy studies reveal that Ag2S filler, in its micro and nano forms, can substantially improve the AC conductivity and dielectric properties of PVA–PEG polymer blend (loaded with Ag2S).