Abstract
The copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability of achieving the product requirements in terms of thermal and reliability in a 3D stacked-die package. The drive towards a Die-Free Package Cost (DFPC) reduction has led the authors to study the used of a thin leadframe in a QFN 3D stacked-die. Hence, the work presents basis for the qualification of a thin leadframe design and also to demonstrate the thermal and reliability performance. Finally, an extensive virtual thermal-mechanical prototyping has to be achieved in order to understand the physics of materials during the assembly and reliability testing of a 3D stacked-die package with a thin leadframe. This design rule was found to be developed in order to prevent a die crack occurrence between die and leadframe in the semiconductor package.
Highlights
The reliability of microelectronic packages is a major concern in the electronic industries
The focusing scope of the analysis is more on the stress that was distributed between two types of leadframe thickness
The Infra Red (IR) reflow process has been recognized to be one of the reliability test procedure and it has been applied after the Moisture Sensitivity Level (MSL) witerion
Summary
The reliability of microelectronic packages is a major concern in the electronic industries. Thermalmechanical stress failure in packaging materials is one of the leading causes of the microelectronic packaging component failure and reliability issues. Because of the Coefficient Thermal Expansion (CTE) mismatch of the constituent materials, the package undergoes periodic thermal stress and strain[1]. Epoxy Molding Compound (EMC) is widely used as encapsulating material for copper leadframe and die in electronic packaging application. This epoxy material has been chosen because of its superior in thermal-mechanical properties and lower cost in production. The leadframe and encapsulating materials are prone to thermo-mechanical failures, which lead to the lowcycle fatigue failure[2]
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
